จำนวน Repository ( 4 )
การศึกษาพฤติกรรมการถ่ายโอนความร้อนในระบบเบรกเพื่อกำหนดค่าการนำความร้อนของผ้าเบรกที่เหมาะสม
Brake pad is a one of products that plays a role in the automotive parts industry and directly affects safety. Therefore there are many designs of brake pads for product development. This research aims to study the thermal conductivity of brake pads and define the thermal conductivity that appropriate to brake pads and also solve the problem of deterioration of braking automotive parts. To achieve this the 3 different ingredient brake pads from Compact International (1994) Co. Ltd. are studied in terms of the heat transfer behavior. The experimental work was set by simulating a brake on the single dynamometer at the braking speed of 50 100 and 130 km/h. As a results the significant parameters are copper and fillers respectively. It affects the heat transfer behavior by means of applying heat from the contact area between the brake pad and the brake disc to the caliper This knowledge will be used in the design of brake pad ingredients to determine the appropriate conductivity of the brake pads.
การศึกษาพฤติกรรมค่าการนำความร้อนแบบไม่เชิงเส้นของวัสดุความเสียดทาน
Nowadays one of the automotive engineering is conductivity of brake pads playing a role in friction coefficient which means safety of customer. Thus thermal properties have been improved using composited materials. This project aims to study the conductivity behavior of 3 different brake pads which are supported by the company Compact International (1994) Ltd. For experimental works temperature based on brake condition was simulated from 200 to 400°C and cooled down from 400 to 200°C at 1 5 and 8 MPa of pressure respectively. By standard JIS D4413 testing condition of pressure was referred. The non-linear of conductivity value are calculated from the temperature under steady state condition. As a result of testing there are several of parameters effecting on the non-linear conductivity value. The brake pad that is a mix of high-fiber affects the fluctuation of thermal conductivity. At the same time lubricant in the brake pad cause the stability of conductivity value in different temperature range at the same pressure. On the other hand the brake pad mixed hi-copper inspires the narrow range of conductivity value in different pressures at the same temperature. Moreover the conductivity value as a mention is inversely proportion with the coefficient of kinetic friction.
การศึกษาพฤติกรรมค่าการนำความร้อนของผ้าเบรกรถยนต์
Nowadays one of the automotive engineering is conductivity of brake pads playing a role in friction coefficient which means safety of customer. Thus thermal properties have been improved using composited materials. This project aims to study the conductivity behavior of 3 different brake pads which are supported by the company Compact International (1994) Ltd. For experimental works temperature based on brake condition was simulated from 200 to 400°C and cooled down from 400 to 200°C at 1 5 and 8 MPa of pressure respectively. By standard JIS D4413 testing condition of pressure was referred. The non-linear of conductivity value are calculated from the temperature under steady state condition. As a result of testing there are several of parameters effecting on the non-linear conductivity value. The brake pad that is a mix of high-fiber occurs the fluctuation of thermal conductivity. At the same time lubricant in the brake pad cause the stability of conductivity value in different temperature range at the same pressure. On the other hand the brake pad mixed hi-copper inspires the narrow range of conductivity value in different pressures at the same temperature. Moreover the conductivity value as a mention is inversely proportion with the coefficient of kinetic friction.
Inorganic filler-filled epoxy adhesive for electronic packaging application
As the high performance electronic devices are required the better heat dissipation in electronic packaging is necessary. In this work the thermal diffusivity of epoxy-based adhesive used as an underfill material in electronic packaging can be improved by adding nano-sized inorganic fillers. These fillers including aluminum oxide (Al2O3) silicon nitride (Si3N4) and silicon carbide (SiC) were used alone for preparing particulate filled-epoxy adhesive. Furthermore In order to achieve good dispersion of filler in matrix the adhesive’s preparation process was adjusted. The maximum loading of fillers in adhesive were determined by the homogeneity of filler and matrix. In addition to avoid the agglomeration of filler silane coupling agent was treated onto surface of aluminum oxide filler to improve interfacial interaction between filler and epoxy resin. The effects of the filler type and filler’s loading on the thermal diffusivity of adhesive were investigated using Laserflash.