As the high performance electronic devices are required the better heat dissipation in electronic packaging is necessary. In this work the thermal diffusivity of epoxy-based adhesive used as an underfill material in electronic packaging can be improved by adding nano-sized inorganic fillers. These fillers including aluminum oxide (Al2O3) silicon nitride (Si3N4) and silicon carbide (SiC) were used alone for preparing particulate filled-epoxy adhesive. Furthermore In order to achieve good dispersion of filler in matrix the adhesive’s preparation process was adjusted. The maximum loading of fillers in adhesive were determined by the homogeneity of filler and matrix. In addition to avoid the agglomeration of filler silane coupling agent was treated onto surface of aluminum oxide filler to improve interfacial interaction between filler and epoxy resin. The effects of the filler type and filler’s loading on the thermal diffusivity of adhesive were investigated using Laserflash.

For one-part adhesive systems a long working-life adhesive which can be cured rapidly at processing temperature is required in industrial applications because it provides assembly process versatility. The aim of this research was to study the methods for extending the working-life of an epoxy-based adhesive with anhydride curing agent. This adhesive formulation is used as an underfill material in electronic industry. The scope of this study was divided into two parts: 1) modification of adhesive formulation process 2) determination of the component in adhesive which causes the adhesive viscosity increased at ambient temperature. The results showed that the adhesive working-life extended from 2 hours to 6 hours with reducing formulation process time removing the moisture in filler and reducing fluxing precursor loading in adhesive. In addition the fluxing precursor loading also affects the thermo-mechanical properties of adhesive. For characterization the working-life and thermo-mechanical properties of this formulation were investigated using rheological technique and dynamic mechanical analysis (DMA) respectively.