Using copper wire instead of gold wire can reduce a lot of cost in IC production of semiconductor industrial. However the circuit stability (Circuit Reliability) is less than the use of goal wire. Therefore the study to improve the production of integrated circuits in the part of the wire bonding process by increasing the baking process. It is an important process to improve the quality of the integrated circuit between Cu wire and chip. For this experimental study of baking process it was performed by comparing IMC values at 175 ˚C and 200 ˚C. The quality of workpiece was tested and measured by Scanning Electron Microscope (SEM) machine every 30 minutes. The research experiment found that the temperature with effect to the workpiece quality to stabilize the IMC value was 175 ˚C for 9 hours nevertheless the new temperature at 200 ˚C it has been applied with only 3 hours. Finally the IMC testing result is higher than the average of the at 60% standard acceptable level as other research reviews and it also higher than the acceptable level of the industry level at 80%. Hence this result can reduce time cost of IC and workpieces production and it also including the higher quality of the products.

This research aimed to determine the optimal sand mold mixture’s ratio by using return sand bentonite water content and new sand component. Then the properties of the mixture according to the standards of American Foundrymen’s Society include the ability of compactability moisture content permeability and green compressive strength. This study applied mixture experiments and response surface methodology to determine an optimal sand mold mixture components condition. After the experiment and linear programming it indicated that the condition was at return sand (95.5387 %) bentonite (1.130102 %) water content (2.331196 %) and new sand (1 %). The green sand mold has compactability (58.37923 %) permeability (73.80148 %) moisture 6.5 % and green compressive strength (0.53 Kg/cm2). At this condition the cost is 11.31579 baths per kilogram.

There is a difficulty in using chemical in disinfestations process in organic rice products therefore this research was aimed to study the optimal setting of infrared radiation heating for disinfestations in Organic Hom Mali Rice. Disinfestations process and rice storage were collected by surveying coupled with interviewing the rice milling enterprise. The infrared radiation heating used in this experiment was belt type with lamp power of 1000 watt. In this study Design of experimental technique was applied to generate the optimum setting of the infrared heating process. The experiments generated by Box Behnken design were 15 experiments and 2 replicate times therefore the total experiments were 30 times. The 3 factors include heating temperature gap between rice and infrared lamp and rice layer thickness. The result from statistical data analysis at reliability level of 95 % shown that the optimization value were heating temperature of 70 oC height of lamp above rice of 10 cm. and rice thickness of 0.5 cm insects mortality rate within 2-3 minutes. Rice after heating were subjected to naturally slow cooling by air therefore rice quality in a good condition without broken or cracking.