This study was undertaken to determine effect of bio-extract fermented from pig placenta and effect of wood vinegar solutions on seed germination percentage and speed of germination of 2 rice cultivars Chai Nat 1 and Sang Yod Phattalung. The experiment was conducted in factorial in completely randomized design with 2 factors and 4 replications. The first factor was ratios of the solutions to water and the second was duration for seed incubation. The results demonstrated that wood vinegar showed more positive effect on rice seed germination performances than that of bio-extract. Speed of germination was affected by an inter-action between the dilutions of the solutions and the duration for seed incubation. In Chai nat 1 experiment the seed soaked in 20 times dilution of bio-extract and subsequently incubated for 24 hrs increased speed of germination of the seed. While soaking the seed in 400 times dilution of wood vinegar and incubated for 24 hrs could enhance both percentage and speed of the seed germination. In Sang Yod Phattalung experiment soaking the seed in 50 times dilution of bio-extract and subsequently incubated for 48 hrs or soaking the seed in 300 times dilution of wood vinegar and incubated for 48 hrs could enhance both percentage and speed of seed germination. According to the results we concluded that soaking rice seed in bio-extract of pig placenta fermentation or in wood vinegar solutions could enhance the seed quality.

For one-part adhesive systems a long working-life adhesive which can be cured rapidly at processing temperature is required in industrial applications because it provides assembly process versatility. The aim of this research was to study the methods for extending the working-life of an epoxy-based adhesive with anhydride curing agent. This adhesive formulation is used as an underfill material in electronic industry. The scope of this study was divided into two parts: 1) modification of adhesive formulation process 2) determination of the component in adhesive which causes the adhesive viscosity increased at ambient temperature. The results showed that the adhesive working-life extended from 2 hours to 6 hours with reducing formulation process time removing the moisture in filler and reducing fluxing precursor loading in adhesive. In addition the fluxing precursor loading also affects the thermo-mechanical properties of adhesive. For characterization the working-life and thermo-mechanical properties of this formulation were investigated using rheological technique and dynamic mechanical analysis (DMA) respectively.